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d a t a sh eet product speci?cation supersedes data of 1998 apr 28 2002 mar 15 integrated circuits 74LVC14A hex inverting schmitt-trigger with 5 v tolerant input
2002 mar 15 2 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A features wide supply voltage range from 1.2 to 3.6 v cmos low power consumption direct interface with ttl levels inputs accept voltages up to 5.5 v complies with jedec standard no. 8-1a specified from - 40 to +85 c and - 40 to +125 c. applications wave and pulse shapers for highly noisy environments astable multivibrators monostable multivibrators. description the 74LVC14A is a high-performance, low-power, low-voltage, si-gate cmos device, superior to most advanced cmos compatible ttl families. inputs can be driven from either 3.3 or 5 v devices. this feature allows the use of these devices as translators in a mixed 3.3 and 5 v environment. the 74LVC14A provides six inverting buffers with schmitt-trigger action. it is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. quick reference data gnd = 0 v; t amb =25 c; t r =t f 2.5 ns. notes 1. c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i + ? (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; ? (c l v cc 2 f o ) = sum of outputs; c l = output load capacitance in pf; v cc = supply voltage in volts. 2. the condition is v i = gnd to v cc . symbol parameter conditions typical unit t phl /t plh propagation delay na to ny c l = 50 pf; v cc = 3.3 v 3.2 ns c i input capacitance 4.0 pf c pd power dissipation capacitance v cc = 3.3 v; notes 1 and 2 10 pf
2002 mar 15 3 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A ordering information function table see note 1. note 1. h = high voltage level; l = low voltage level. pinning type number temperature range packages pins package material code 74LVC14Ad - 40 to +125 c 14 so plastic sot108-1 74LVC14Adb - 40 to +125 c 14 ssop plastic sot337-1 74LVC14Apw - 40 to +125 c 14 tssop plastic sot402-1 inputs outputs na ny lh hl pin symbol description 1, 3, 5, 9, 11 and 13 1a to 6a data input 2, 4, 6, 8, 10 and 12 1y to 6y data output 7 gnd ground (0 v) 14 v cc supply voltage fig.1 pin configuration. handbook, halfpage mna203 14 1 2 3 4 5 6 7 8 14 13 12 11 10 9 1a 1y 2a 2y 3a 3y gnd 4y 4a 5y 5a 6y 6a v cc handbook, halfpage mna204 1a 1y 1 2 2a 2y 3 4 3a 3y 5 6 4a 4y 9 8 5a 5y 11 10 6a 6y 13 12 fig.2 logic symbol.
2002 mar 15 4 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A fig.3 logic diagram (one schmitt-trigger). handbook, halfpage mna205 a y recommended operating conditions limiting values in accordance with the absolute maximum rating system (iec 60134); voltages are referenced to gnd (ground = 0 v). note 1. the input and output voltage ratings may be exceeded if the input and output current ratings are observed. symbol parameter conditions min. max. unit v cc supply voltage for maximum speed performance 2.7 3.6 v for low voltage applications 1.2 3.6 v v i input voltage 0 5.5 v v o output voltage 0 v cc v t amb operating ambient temperature - 40 +125 c t r ,t f input rise and fall times v cc = 1.2 to 2.7 v 0 20 ns/v v cc = 2.7 to 3.6 v 0 10 ns/v symbol parameter conditions min. max. unit v cc supply voltage - 0.5 +6.5 v i ik input diode current v i <0 -- 50 ma v i input voltage note 1 - 0.5 +6.5 v i ok output diode current v o >v cc or v o <0 - 50 ma v o output voltage note 1 - 0.5 v cc + 0.5 v i o output source or sink current v o = 0 to v cc - 50 ma i gnd , i cc v cc or gnd current - 100 ma t stg storage temperature - 65 +150 c p tot power dissipation per package so package above 70 c derate linearly with 8 mw/k - 500 mw ssop and tssop packages above 60 c derate linearly with 5.5 mw/k - 500 mw
2002 mar 15 5 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A dc characteristics over recommended operating conditions; voltages are referenced to gnd (groun d=0v). note 1. all typical values are measured at v cc = 3.3 v and t amb =25 c. symbol parameter test conditions t amb ( c) unit other v cc (v) - 40 to +85 - 40 to +125 min. typ. (1) max. min. max. v oh high-level output voltage v i =v ih or v il i o = - 100 m a 2.7 to 3.6 v cc - 0.2 -- v cc - 0.3 - v i o = - 8 ma 2.3 to 2.7 v cc - 0.5 -- v cc - 0.65 - v i o = - 12 ma 2.7 v cc - 0.5 -- v cc - 0.65 - v i o = - 18 ma 3.0 v cc - 0.6 -- v cc - 0.75 - v i o = - 24 ma 3.0 v cc - 0.8 -- v cc - 1 - v v ol low-level output voltage v i =v ih or v il i o = 100 m a 2.7 to 3.6 -- 0.2 - 0.3 v i o = 8 ma 2.3 to 2.7 -- 0.6 - 0.75 v i o = 12 ma 2.7 -- 0.4 - 0.6 v i o = 24 ma 3.0 -- 0.55 - 0.8 v i i input leakage current v i = 5.5 v or gnd 3.6 - 0.1 5 - 20 m a i cc quiescent supply current v i =v cc or gnd; i o =0 3.6 - 0.1 10 - 40 m a d i cc additional quiescent supply current per input pin v i =v cc - 0.6v; i o =0 2.7 to 3.6 - 5 500 - 5000 m a
2002 mar 15 6 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A transfer characteristics voltages are referenced to gnd (ground = 0 v). notes 1. all typical values are measured at t amb =25 c. 2. the v ih and v il from the dc family characteristics are superseded by the v t+ and v t - . symbol parameter test conditions t amb ( c) unit waveforms v cc (v) - 40 to +85 - 40 to +125 min. typ. (1) max. min. max. v t+ positive-going threshold see figs 4 and 5 1.2 -- 1.2 - 1.2 v 2.5 0.9 - 1.7 0.9 1.7 v 2.7 1.1 - 2.0 1.1 2.0 v 2.7 to 3.6 1.1 - 2.0 1.1 2.0 v v t - negative-going threshold see figs 4 and 5 1.2 0 -- 0 - v 2.5 0.4 - 1.2 0.4 1.2 v 2.7 0.8 - 1.5 0.8 1.5 v 2.7 to 3.6 0.8 - 1.5 0.8 1.5 v v h hysteresis (v t+ - v t - ) see figs 4, 5 and 6 1.2 ----- v 2.5 0.3 -- 0.2 - v 2.7 0.3 0.4 - 0.3 - v 2.7 to 3.6 0.3 0.45 (2) - 0.3 - v handbook, halfpage mna026 v o v h v i v t - v t + fig.4 transfer characteristic.
2002 mar 15 7 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A handbook, halfpage mna208 v o v i v h v t + v t - fig.5 definition of v t+ , v t - and v h v t+ and v t - are between limits of 20% and 70% handbook, halfpage 0 0.6 1.2 3 5 4 0 1 2 3 mna582 1.8 2.4 v in (v) i cc (ma) fig.6 typical 74LVC14A transfer characteristic. v cc = 3.3 v. ac characteristics gnd = 0 v; t r =t f 2.5 ns. notes 1. all typical values are measured at v cc = 3.3 v. 2. skew between any two outputs of the same package switching in the same direction. this parameter is guaranteed by design. symbol parameter waveforms t amb ( c) unit - 40 to +85 - 40 to +125 min. typ. (1) max. min. max. v cc = 1.2 v t phl /t plh propagation delay na to ny see figs 7 and 8 - 16 --- ns v cc = 2.3 to 2.7 v t phl /t plh propagation delay na to ny see figs 7 and 8 1.5 4.0 7.8 1.5 10.0 ns v cc = 2.7 v t phl /t plh propagation delay na to ny see figs 7 and 8 1.5 3.6 7.5 1.5 9.5 ns v cc = 3.0 to 3.6 v t phl /t plh propagation delay na to ny see figs 7 and 8 1.0 3.2 6.4 1.0 8.0 ns t sk(0) skew note 2 -- 1.0 - 1.5 ns
2002 mar 15 8 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A ac waveforms handbook, halfpage mna344 t phl t plh v m v m na input ny output gnd v i v oh v ol fig.7 input na to output ny propagation delays. v m = 1.5 v at v cc 3 2.7 v; v m = 0.5v cc at v cc < 2.7 v. v ol and v oh are typical output voltage drop that occur with the output load. handbook, full pagewidth open gnd 2 v cc v cc v i v o mna505 d.u.t. c l r t r load r load pulse generator s1 fig.8 load circuitry for switching times. definitions for test circuits: r l = load resistor. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to the output impedance z o of the pulse generator. v cc v i c l r load t plh /t phl 1.2 v v cc 30 pf 500 w open 2.3 to 2.7 v v cc 30 pf 500 w open 2.7 v 2.7 v 50 pf 500 w open 3.0 to 3.6 v 2.7 v 50 pf 500 w open
2002 mar 15 9 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A application information handbook, halfpage 2.1 2.7 3.9 2.5 0.5 1.5 1.0 2.0 mna581 3.3 2.4 3.0 3.6 v cc (v) average i cc (ma) negative-going edge positive-going edge fig.9 average supply current as a function of supply voltage. all values given are typical values; unless otherwise specified. linear change of v i between 0.8 to 2.0 v. handbook, halfpage mna035 r c fig.10 relaxation oscillator using the 74lvc14. f 1 t --- 1 0.8 rc ----------------------- ? =
2002 mar 15 10 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A package outlines unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 sot108-1 x w m q a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 97-05-22 99-12-27 0 2.5 5 mm scale so14: plastic small outline package; 14 leads; body width 3.9 mm sot108-1
2002 mar 15 11 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 0.2 7.9 7.6 1.03 0.63 0.9 0.7 1.4 0.9 8 0 o o 0.13 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot337-1 96-01-18 99-12-27 (1) w m b p d h e e z e c v m a x a y 1 7 14 8 q a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale ssop14: plastic shrink small outline package; 14 leads; body width 5.3 mm sot337-1 a max. 2.0
2002 mar 15 12 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec eiaj mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.72 0.38 8 0 o o 0.13 0.1 0.2 1.0 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot402-1 mo-153 95-04-04 99-12-27 w m b p d z e 0.25 17 14 8 q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm sot402-1 a max. 1.10 pin 1 index
2002 mar 15 13 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2002 mar 15 14 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package soldering method wave reflow (1) bga, hbga, lfbga, sqfp, tfbga not suitable suitable hbcc, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable
2002 mar 15 15 philips semiconductors product speci?cation hex inverting schmitt-trigger with 5 v tolerant input 74LVC14A data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. data sheet status (1) product status (2) definitions objective data development this data sheet contains data from the objective specification for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. preliminary data quali?cation this data sheet contains data from the preliminary specification. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. product data production this data sheet contains data from the product specification. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. changes will be communicated according to the customer product/process change noti?cation (cpcn) procedure snw-sq-650a. definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? koninklijke philips electronics n.v. 2002 sca74 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands 613508/02/pp 16 date of release: 2002 mar 15 document order number: 9397 750 09449

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